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Hot Air Reflow oven HR-300
The HR-300 is an extremely user-friendly convection oven suitable for lead-free SMD soldering of printed circuit boards.
It has many advantages especially fully controlled reflow cycle in closed oven!
HR-300 functional description:
The special feature of this reflow oven is that the complete cycle takes place in a closed oven.
We have 2400W heating power and hot air circulation to ensure even heat distribution.
Even complicated components like GPS antennas or BGA's can be soldered very well.
As this reflow oven has an exhaust fan, the exhaust gases can be exhausted from the room via a 100mm hose.
All parameters are easy to set and only the temperature to be reached and the dwell time have to be set.
The duration of the heating phase is dynamic until the target temperature is reached, then the fixed holding time expires.
A special feature is the controlled cooling which also reheats when the temperature drops too quickly.
Our HR-300 reflow oven is the perfect solution for prototype production and as a supplement to a vapour phase.
The constant temperature mode can be used to bake components!
Ovens are shipping from Germany.
Technical data:
Reflow oven chamber size is 400x310mm.
New 110V / 1800W version added!
Please ask sunny@smallsmt.biz for download password.
HR-300 230V
POWER SUPPLY: 230V
MAX POWER: 2400W
HEATER: Infrared radiation heating & hot air circulation
COOLING: Exhaust ventilator 100mm tube outlet
REFLOW AREA: 350x300mm
MODES: 4 reflow profiles, constant heating mode for drying
PC INTERFACE: Profiles can get updated by PC software over RS232 interface
DIMENSIONS: 523 x 500 x 314mm
WEIGHT: 28Kg
HR-300 Reflow Oven
$1,094.00
Final price excl. shipping costs
- 28 kg
- Available
- Ships within 1-3 days1
HR-300 110V
POWER SUPPLY: 110V
MAX POWER:1800W
HEATER: Infrared radiation heating & hot air circulation
COOLING: Exhaust ventilator 100mm tube outlet
REFLOW AREA: 350x300mm
MODES: 4 reflow profiles, constant heating mode for drying
PC INTERFACE: Profiles can get updated by PC software over RS232 interface
DIMENSIONS: 523 x 500 x 314mm
WEIGHT: 28Kg
HR-300 Reflow Oven
$1,094.00
Final price excl. shipping costs
- 28 kg
- Available
- Ships within 1-3 days1
Example Profiles
Loctite GC10
| GC10 Example | Temperature | Time |
| READY | 100°C | 01:00 |
| HEAT | 210°C | 00:30 |
| WELD | 240°C | 00:10 |
| HOLD | 220°C | 00:05 |
| COOL | 100°C | 00:00 |
Artikelnummer:2376530089554
|
Felder |
Temperature | Time |
| READY | 100°C | 01:00 |
| HEAT | 200°C | 00:30 |
| WELD | 230°C | 00:10 |
| HOLD | 210°C | 00:05 |
| COOL | 100°C | 00:00 |
Measured Temperature in machine using this profile
We carried out a temperature test and first calibrated the new oven in constant temperature mode.
The setup menu is accessed by pressing the Run and Enter buttons simultaneously.
A temperature deviation of 15 degrees was compensated. Then checked again in constant temperature mode.
The GC10 profile listed above was then used as the test.
GALLERY
Nice demo job perfect result for hand placed samples
First demo job
Oversized PCB demo job
All parts soldered fine except the IC's inside the copper plane but this is an design issue.
A reflow oven is a machine used in the process of surface mount technology (SMT) to attach electronic components to a printed circuit board (PCB). It works by heating the PCB and components to a temperature high enough to melt the solder paste, which then reflows and solidifies to form a permanent connection between the components and the PCB.
Here is a basic explanation of the reflow process:
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Preheat: The reflow oven begins by heating the PCB to a low temperature to remove any moisture and prepare it for the soldering process.
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Ramp-up: The temperature is gradually increased to a specified temperature range, known as the "preheat zone", where the solder paste starts to become active.
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Soak: The temperature is held within the preheat zone for a specified time to allow the solder paste to become evenly distributed and the components to stabilize.
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Reflow: The temperature is then rapidly increased to a higher temperature, known as the "reflow zone", where the solder paste reaches its melting point and reflows.
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Cooling: The temperature is then gradually decreased to a safe level, where the solder solidifies and the components are firmly attached to the PCB.
The entire process is carefully controlled to ensure consistent results and to prevent damage to the components or the PCB. The temperature profile of the reflow process is typically determined based on the type of solder paste and components being used.
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